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"Simulation and Experimental Investigation on Active Thermography Test of ..."

Libo Zhao et al. (2020)

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DOI: 10.1109/TII.2019.2945583

access: closed

type: Journal Article

metadata version: 2022-10-02

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Libo Zhao, Zhenzhi He, Zengxiang Wang, Lei Su, Xiangning Lu:
Simulation and Experimental Investigation on Active Thermography Test of the Solder Balls. IEEE Trans. Ind. Informatics 16(3): 1617-1624 (2020)

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