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"Localization of Electrical Defects in Hybrid Bonding Interconnect ..."

Kristof J. P. Jacobs, Michele Stucchi, Eric Beyne (2021)

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DOI: 10.1109/TIM.2021.3108531

access: closed

type: Journal Article

metadata version: 2021-09-16

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Kristof J. P. Jacobs, Michele Stucchi, Eric Beyne:
Localization of Electrical Defects in Hybrid Bonding Interconnect Structures by Scanning Photocapacitance Microscopy. IEEE Trans. Instrum. Meas. 70: 1-7 (2021)

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