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"A Hybrid De-Embedding Method for Low Loss and Reciprocal PCB Fixtures."

Bo-Wen Liu, Xing-Chang Wei, Chong-Xin Xv (2022)

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DOI: 10.1109/TIM.2022.3169162

access: closed

type: Journal Article

metadata version: 2022-05-18

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Bo-Wen Liu, Xing-Chang Wei, Chong-Xin Xv:
A Hybrid De-Embedding Method for Low Loss and Reciprocal PCB Fixtures. IEEE Trans. Instrum. Meas. 71: 1-8 (2022)

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