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"Measurement and Error Analysis of Cu Film Thickness With Ta Barrier Layer ..."

Zilian Qu et al. (2021)

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DOI: 10.1109/TIM.2020.3017057

access: closed

type: Journal Article

metadata version: 2020-12-17

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Zilian Qu, Wensong Wang, Xueli Li, Qi Li, Yuanjin Zheng:
Measurement and Error Analysis of Cu Film Thickness With Ta Barrier Layer on Wafer for CMP Application. IEEE Trans. Instrum. Meas. 70: 1-10 (2021)

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