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"Allocating power ground vias in 3D ICs for simultaneous power and thermal ..."

Hao Yu, Joanna Ho, Lei He (2009)

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DOI: 10.1145/1529255.1529263

access: closed

type: Journal Article

metadata version: 2018-11-06

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Hao Yu, Joanna Ho, Lei He:
Allocating power ground vias in 3D ICs for simultaneous power and thermal integrity. ACM Trans. Design Autom. Electr. Syst. 14(3): 41:1-41:31 (2009)

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