Search dblp for Publications

export results for "toc:db/conf/3dic/3dic2021.bht:"

 download as .bib file

@inproceedings{DBLP:conf/3dic/BakerPF21,
  author       = {Lee Baker and
                  Robert Patti and
                  Paul D. Franzon},
  title        = {Multi-ANN embedded system based on a custom 3D-DRAM},
  booktitle    = {{IEEE} International 3D Systems Integration Conference, 3DIC 2021,
                  Raleigh, NC, USA, October 26-29, 2021},
  pages        = {1--7},
  publisher    = {{IEEE}},
  year         = {2021},
  url          = {https://doi.org/10.1109/3DIC52383.2021.9687617},
  doi          = {10.1109/3DIC52383.2021.9687617},
  timestamp    = {Thu, 23 Jun 2022 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/BakerPF21.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/3dic/DubarryAMMMCBA21,
  author       = {Christophe Dubarry and
                  Lucile Arnaud and
                  Maria{-}Luisa Calvo{-}Mu{\~{n}}oz and
                  Ga{\"{e}}lle Mauguen and
                  St{\'{e}}phane Moreau and
                  R. Crochemore and
                  Nicolas Bresson and
                  Bernard Aventurier},
  title        = {3D interconnection using copper direct hybrid bonding for GaN on silicon
                  wafer},
  booktitle    = {{IEEE} International 3D Systems Integration Conference, 3DIC 2021,
                  Raleigh, NC, USA, October 26-29, 2021},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2021},
  url          = {https://doi.org/10.1109/3DIC52383.2021.9687599},
  doi          = {10.1109/3DIC52383.2021.9687599},
  timestamp    = {Thu, 07 Sep 2023 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/DubarryAMMMCBA21.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/3dic/FukushimaSTHBMK21,
  author       = {Takafumi Fukushima and
                  Shinichi Sakuyama and
                  Masatomo Takahashi and
                  Hiroyuki Hashimoto and
                  Jichoel Bea and
                  Theodorus Marcello and
                  Hisashi Kino and
                  Tetsu Tanaka and
                  Mitsumasa Koyanagi and
                  Mariappan Murugesan},
  title        = {Integration of Damage-less Probe Cards Using Nano-TSV Technology for
                  Microbumped Wafer Testing},
  booktitle    = {{IEEE} International 3D Systems Integration Conference, 3DIC 2021,
                  Raleigh, NC, USA, October 26-29, 2021},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2021},
  url          = {https://doi.org/10.1109/3DIC52383.2021.9687601},
  doi          = {10.1109/3DIC52383.2021.9687601},
  timestamp    = {Fri, 18 Feb 2022 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/conf/3dic/FukushimaSTHBMK21.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/3dic/FurueM21,
  author       = {Ayano Furue and
                  Satoshi Matsumoto},
  title        = {Numerical investigations for 3D power supply on chip by coupling of
                  thermal-fluid, circuit, and electromagnetic field simulations},
  booktitle    = {{IEEE} International 3D Systems Integration Conference, 3DIC 2021,
                  Raleigh, NC, USA, October 26-29, 2021},
  pages        = {1--5},
  publisher    = {{IEEE}},
  year         = {2021},
  url          = {https://doi.org/10.1109/3DIC52383.2021.9687610},
  doi          = {10.1109/3DIC52383.2021.9687610},
  timestamp    = {Fri, 18 Feb 2022 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/conf/3dic/FurueM21.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/3dic/HorioOKK21,
  author       = {Yoshihiko Horio and
                  Takemori Orima and
                  Koji Kiyoyama and
                  Mitsumasa Koyanagi},
  title        = {Implementation of a Chaotic Neural Network Reservoir on a TSV/{\textdollar}{\textbackslash}mu{\textbackslash}text\{Bump\}{\textdollar}
                  Stacked 3D Cyclic Neural Network Integrated Circuit},
  booktitle    = {{IEEE} International 3D Systems Integration Conference, 3DIC 2021,
                  Raleigh, NC, USA, October 26-29, 2021},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2021},
  url          = {https://doi.org/10.1109/3DIC52383.2021.9687614},
  doi          = {10.1109/3DIC52383.2021.9687614},
  timestamp    = {Wed, 23 Feb 2022 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/conf/3dic/HorioOKK21.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/3dic/HuGLZLT21,
  author       = {Liangxing Hu and
                  Simon Chun Kiat Goh and
                  Yu Dian Lim and
                  Peng Zhao and
                  Michael Joo Zhong Lim and
                  Chuan Seng Tan},
  title        = {Multi-Die to Wafer Bonding Through Plasma-Activated Cu-Cu Direct Bonding
                  in Ambient Conditions},
  booktitle    = {{IEEE} International 3D Systems Integration Conference, 3DIC 2021,
                  Raleigh, NC, USA, October 26-29, 2021},
  pages        = {1--5},
  publisher    = {{IEEE}},
  year         = {2021},
  url          = {https://doi.org/10.1109/3DIC52383.2021.9687609},
  doi          = {10.1109/3DIC52383.2021.9687609},
  timestamp    = {Sat, 30 Sep 2023 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/HuGLZLT21.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/3dic/KaulLPYB21,
  author       = {Ankit Kaul and
                  Yandong Luo and
                  Xiaochen Peng and
                  Shimeng Yu and
                  Muhannad S. Bakir},
  title        = {Thermal Reliability Considerations of Resistive Synaptic Devices for
                  3D {CIM} System Performance},
  booktitle    = {{IEEE} International 3D Systems Integration Conference, 3DIC 2021,
                  Raleigh, NC, USA, October 26-29, 2021},
  pages        = {1--5},
  publisher    = {{IEEE}},
  year         = {2021},
  url          = {https://doi.org/10.1109/3DIC52383.2021.9687612},
  doi          = {10.1109/3DIC52383.2021.9687612},
  timestamp    = {Tue, 21 Mar 2023 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/conf/3dic/KaulLPYB21.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/3dic/KiyoyamaHFHOK21,
  author       = {Koji Kiyoyama and
                  Yoshihiko Horio and
                  Takafumi Fukushima and
                  Hiroyuki Hashimoto and
                  Takemori Orima and
                  Mitsumasa Koyanagi},
  title        = {Design for 3-D Stacked Neural Network Circuit with Cyclic Analog Computing},
  booktitle    = {{IEEE} International 3D Systems Integration Conference, 3DIC 2021,
                  Raleigh, NC, USA, October 26-29, 2021},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2021},
  url          = {https://doi.org/10.1109/3DIC52383.2021.9687608},
  doi          = {10.1109/3DIC52383.2021.9687608},
  timestamp    = {Wed, 23 Feb 2022 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/conf/3dic/KiyoyamaHFHOK21.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/3dic/KrugerVW21,
  author       = {Patrick Kr{\"{u}}ger and
                  Thomas Vo{\ss} and
                  Matthias Wietstruck},
  title        = {Bond Strength Optimization of Plasma Activated Low Temperature Oxide-Oxide
                  Fusion Bonding Through Thermocycling},
  booktitle    = {{IEEE} International 3D Systems Integration Conference, 3DIC 2021,
                  Raleigh, NC, USA, October 26-29, 2021},
  pages        = {1--5},
  publisher    = {{IEEE}},
  year         = {2021},
  url          = {https://doi.org/10.1109/3DIC52383.2021.9687600},
  doi          = {10.1109/3DIC52383.2021.9687600},
  timestamp    = {Fri, 18 Feb 2022 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/conf/3dic/KrugerVW21.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/3dic/MastroianniKNCW21,
  author       = {Anthony Mastroianni and
                  Benjamin Kerr and
                  Jawad Nasrullah and
                  Kevin Cameron and
                  Hockshan James Wong and
                  David Ratchkov and
                  Joseph A. Reynick},
  title        = {Proposed Standardization of Heterogenous Integrated Chiplet Models},
  booktitle    = {{IEEE} International 3D Systems Integration Conference, 3DIC 2021,
                  Raleigh, NC, USA, October 26-29, 2021},
  pages        = {1--8},
  publisher    = {{IEEE}},
  year         = {2021},
  url          = {https://doi.org/10.1109/3DIC52383.2021.9687611},
  doi          = {10.1109/3DIC52383.2021.9687611},
  timestamp    = {Wed, 23 Feb 2022 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/conf/3dic/MastroianniKNCW21.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/3dic/MiyasakaM21,
  author       = {Shinei Miyasaka and
                  Satoshi Matsumoto},
  title        = {Numerical predictions of 3D power-supply on chip taking into considerations
                  of proximity effect},
  booktitle    = {{IEEE} International 3D Systems Integration Conference, 3DIC 2021,
                  Raleigh, NC, USA, October 26-29, 2021},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2021},
  url          = {https://doi.org/10.1109/3DIC52383.2021.9687606},
  doi          = {10.1109/3DIC52383.2021.9687606},
  timestamp    = {Fri, 04 Aug 2023 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/MiyasakaM21.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/3dic/MurugesanSSMSFK21,
  author       = {Mariappan Murugesan and
                  E. Sone and
                  A. Simomura and
                  Makoto Motoyoshi and
                  M. Sawa and
                  K. Fukuda and
                  Mitsumasa Koyanagi and
                  Takafumi Fukushima},
  title        = {Cu-Cu Direct Bonding Through Highly Oriented Cu Grains for 3D-LSI
                  Applications},
  booktitle    = {{IEEE} International 3D Systems Integration Conference, 3DIC 2021,
                  Raleigh, NC, USA, October 26-29, 2021},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2021},
  url          = {https://doi.org/10.1109/3DIC52383.2021.9687604},
  doi          = {10.1109/3DIC52383.2021.9687604},
  timestamp    = {Fri, 18 Feb 2022 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/conf/3dic/MurugesanSSMSFK21.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/3dic/OgushiM21,
  author       = {Yuske Ogushi and
                  Satoshi Matsumoto},
  title        = {Fully integrated transformer less floating gate driver for 3D power
                  supply on chip},
  booktitle    = {{IEEE} International 3D Systems Integration Conference, 3DIC 2021,
                  Raleigh, NC, USA, October 26-29, 2021},
  pages        = {1--6},
  publisher    = {{IEEE}},
  year         = {2021},
  url          = {https://doi.org/10.1109/3DIC52383.2021.9687603},
  doi          = {10.1109/3DIC52383.2021.9687603},
  timestamp    = {Fri, 18 Feb 2022 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/conf/3dic/OgushiM21.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/3dic/RajanKMB21,
  author       = {Sreejith Kochupurackal Rajan and
                  Ankit Kaul and
                  Gary S. May and
                  Muhannad S. Bakir},
  title        = {Electrical and Performance Benefits of Advanced Monolithic Cooling
                  for 2.5D Heterogeneous ICs},
  booktitle    = {{IEEE} International 3D Systems Integration Conference, 3DIC 2021,
                  Raleigh, NC, USA, October 26-29, 2021},
  pages        = {1--5},
  publisher    = {{IEEE}},
  year         = {2021},
  url          = {https://doi.org/10.1109/3DIC52383.2021.9687618},
  doi          = {10.1109/3DIC52383.2021.9687618},
  timestamp    = {Fri, 18 Feb 2022 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/conf/3dic/RajanKMB21.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/3dic/RavichandiranF21,
  author       = {Prasanth Prabu Ravichandiran and
                  Paul D. Franzon},
  title        = {A Review of 3D-Dynamic Random-Access Memory based Near-Memory Computation},
  booktitle    = {{IEEE} International 3D Systems Integration Conference, 3DIC 2021,
                  Raleigh, NC, USA, October 26-29, 2021},
  pages        = {1--6},
  publisher    = {{IEEE}},
  year         = {2021},
  url          = {https://doi.org/10.1109/3DIC52383.2021.9687615},
  doi          = {10.1109/3DIC52383.2021.9687615},
  timestamp    = {Thu, 23 Jun 2022 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/RavichandiranF21.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/3dic/ZhangDYRC21,
  author       = {Ziyue Zhang and
                  Yingtao Ding and
                  Baoyan Yang and
                  Anrun Ren and
                  Zhiming Chen},
  title        = {A Low-Cost and Low-Temperature Method to Realize Carbon Nanotube Conductor
                  in Through-Silicon-Via},
  booktitle    = {{IEEE} International 3D Systems Integration Conference, 3DIC 2021,
                  Raleigh, NC, USA, October 26-29, 2021},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2021},
  url          = {https://doi.org/10.1109/3DIC52383.2021.9687607},
  doi          = {10.1109/3DIC52383.2021.9687607},
  timestamp    = {Tue, 07 May 2024 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/ZhangDYRC21.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/3dic/ZhaoD21,
  author       = {Qianli Zhao and
                  W. Rhett Davis},
  title        = {A Virtual Platform for Object Detection Systems},
  booktitle    = {{IEEE} International 3D Systems Integration Conference, 3DIC 2021,
                  Raleigh, NC, USA, October 26-29, 2021},
  pages        = {1--6},
  publisher    = {{IEEE}},
  year         = {2021},
  url          = {https://doi.org/10.1109/3DIC52383.2021.9687602},
  doi          = {10.1109/3DIC52383.2021.9687602},
  timestamp    = {Thu, 23 Jun 2022 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/ZhaoD21.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@proceedings{DBLP:conf/3dic/2021,
  title        = {{IEEE} International 3D Systems Integration Conference, 3DIC 2021,
                  Raleigh, NC, USA, October 26-29, 2021},
  publisher    = {{IEEE}},
  year         = {2021},
  url          = {https://doi.org/10.1109/3DIC52383.2021},
  doi          = {10.1109/3DIC52383.2021},
  isbn         = {978-1-6654-1706-8},
  timestamp    = {Fri, 18 Feb 2022 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/conf/3dic/2021.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
a service of  Schloss Dagstuhl - Leibniz Center for Informatics

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.