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export results for "Mechanism of soft and hard breakdown in hexagonal boron nitride 2D dielectrics."

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@inproceedings{DBLP:conf/irps/RanjanROMBSP18,
  author       = {Alok Ranjan and
                  Nagarajan Raghavan and
                  Sean J. O'Shea and
                  Sen Mei and
                  Michel Bosman and
                  Kalya Shubhakar and
                  Kin Leong Pey},
  title        = {Mechanism of soft and hard breakdown in hexagonal boron nitride 2D
                  dielectrics},
  booktitle    = {{IEEE} International Reliability Physics Symposium, {IRPS} 2018, Burlingame,
                  CA, USA, March 11-15, 2018},
  pages        = {4},
  publisher    = {{IEEE}},
  year         = {2018},
  url          = {https://doi.org/10.1109/IRPS.2018.8353574},
  doi          = {10.1109/IRPS.2018.8353574},
  timestamp    = {Tue, 21 Mar 2023 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/conf/irps/RanjanROMBSP18.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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