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@inproceedings{DBLP:conf/3dic/PrietoCCHCRDRFB16,
  author       = {Rafael Prieto and
                  Perceval Coudrain and
                  Jean{-}Philippe Colonna and
                  Y. Hallez and
                  Christian Chancel and
                  V. Rat and
                  Sylvain Dumas and
                  G. Romano and
                  R. Franiatte and
                  C. Brunet{-}Manquiat and
                  S{\'{e}}verine Cheramy and
                  Alexis Farcy},
  title        = {Heat spreading packaging solutions for hybrid bonded 3D-ICs},
  booktitle    = {2016 {IEEE} International 3D Systems Integration Conference, 3DIC
                  2016, San Francisco, CA, USA, November 8-11, 2016},
  pages        = {1--6},
  publisher    = {{IEEE}},
  year         = {2016},
  url          = {https://doi.org/10.1109/3DIC.2016.7970038},
  doi          = {10.1109/3DIC.2016.7970038},
  timestamp    = {Thu, 21 Jan 2021 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/conf/3dic/PrietoCCHCRDRFB16.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/3dic/JouveSGDCAABDFC15,
  author       = {Amadine Jouve and
                  Y. Sinquin and
                  Arnaud Garnier and
                  M. Daval and
                  Pascal Chausse and
                  M. Argoud and
                  N. Allouti and
                  Laurence Baud and
                  J{\'{e}}r{\^{o}}me Dechamp and
                  R. Franiatte and
                  S{\'{e}}verine Cheramy and
                  H. Kato and
                  K. Kondo},
  title        = {Silicon based dry-films evaluation for 2.5D and 3D Wafer-Level system
                  integration improvement},
  booktitle    = {2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai,
                  Japan, August 31 - September 2, 2015},
  pages        = {TS1.4.1--TS1.4.8},
  publisher    = {{IEEE}},
  year         = {2015},
  url          = {https://doi.org/10.1109/3DIC.2015.7334553},
  doi          = {10.1109/3DIC.2015.7334553},
  timestamp    = {Wed, 16 Oct 2019 14:14:50 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/JouveSGDCAABDFC15.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/3dic/JoblotFHJCGAFCFLC13,
  author       = {Sylvain Joblot and
                  Alexis Farcy and
                  Nicolas Hotellier and
                  Amadine Jouve and
                  Fran{\c{c}}ois de Crecy and
                  Arnaud Garnier and
                  M. Argoud and
                  C. Ferrandon and
                  J.{-}P. Colonna and
                  R. Franiatte and
                  C. Laviron and
                  S{\'{e}}verine Cheramy},
  title        = {Wafer level encapsulated materials evaluation for chip on wafer (CoW)
                  approach in 2.5D Si interposer integration},
  booktitle    = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
                  San Francisco, CA, USA, October 2-4, 2013},
  pages        = {1--7},
  publisher    = {{IEEE}},
  year         = {2013},
  url          = {https://doi.org/10.1109/3DIC.2013.6702394},
  doi          = {10.1109/3DIC.2013.6702394},
  timestamp    = {Wed, 16 Oct 2019 14:14:50 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/JoblotFHJCGAFCFLC13.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}