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export results for "Thermomechanical Modeling of Electronic packages."

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@article{DBLP:journals/ijmssc/JagannathanP11,
  author       = {N. Jagannathan and
                  R. Palaninathan},
  title        = {Thermomechanical Modeling of Electronic packages},
  journal      = {Int. J. Model. Simul. Sci. Comput.},
  volume       = {2},
  number       = {1},
  year         = {2011},
  url          = {https://doi.org/10.1142/S1793962311000384},
  doi          = {10.1142/S1793962311000384},
  timestamp    = {Wed, 27 May 2020 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/journals/ijmssc/JagannathanP11.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@article{DBLP:journals/ibmrd/Sri-JayanthaMBK08,
  author       = {Sri M. Sri{-}Jayantha and
                  Gerald McVicker and
                  Kerry Bernstein and
                  John U. Knickerbocker},
  title        = {Thermomechanical modeling of 3D electronic packages},
  journal      = {{IBM} J. Res. Dev.},
  volume       = {52},
  number       = {6},
  pages        = {623--634},
  year         = {2008},
  url          = {https://doi.org/10.1147/JRD.2008.5388568},
  doi          = {10.1147/JRD.2008.5388568},
  timestamp    = {Fri, 13 Mar 2020 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/journals/ibmrd/Sri-JayanthaMBK08.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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