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export results for "Triple-Layering Technology for Pixel-Parallel CMOS Image Sensors Developed by Hybrid Bonding of SOI Wafers."

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@inproceedings{DBLP:conf/3dic/GotoVWHNIHHSKTH19,
  author       = {Masahide Goto and
                  Joeri De Vos and
                  Toshihisa Watabe and
                  Kei Hagiwara and
                  Masakazu Nanba and
                  Yoshinori Iguchi and
                  Eiji Higurashi and
                  Yuki Honda and
                  Takuya Saraya and
                  Masaharu Kobayashi and
                  Hiroshi Toshiyoshi and
                  Toshiro Hiramoto},
  title        = {Triple-Layering Technology for Pixel-Parallel {CMOS} Image Sensors
                  Developed by Hybrid Bonding of {SOI} Wafers},
  booktitle    = {2019 International 3D Systems Integration Conference (3DIC), Sendai,
                  Japan, October 8-10, 2019},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2019},
  url          = {https://doi.org/10.1109/3DIC48104.2019.9058785},
  doi          = {10.1109/3DIC48104.2019.9058785},
  timestamp    = {Tue, 07 May 2024 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/GotoVWHNIHHSKTH19.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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