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export results for "Underfill selection methodology for fine pitch Cu/low-k FCBGA packages."

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@article{DBLP:journals/mr/OngHOWVLYCTSHC09,
  author       = {Xuefen Ong and
                  Soon Wee Ho and
                  Yue Ying Ong and
                  Leong Ching Wai and
                  Kripesh Vaidyanathan and
                  Yeow Kheng Lim and
                  David Yeo and
                  Kai Chong Chan and
                  Juan Boon Tan and
                  Dong Kyun Sohn and
                  Liang Choo Hsia and
                  Zhong Chen},
  title        = {Underfill selection methodology for fine pitch Cu/low-k {FCBGA} packages},
  journal      = {Microelectron. Reliab.},
  volume       = {49},
  number       = {2},
  pages        = {150--162},
  year         = {2009},
  url          = {https://doi.org/10.1016/j.microrel.2008.11.015},
  doi          = {10.1016/J.MICROREL.2008.11.015},
  timestamp    = {Thu, 14 Oct 2021 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/journals/mr/OngHOWVLYCTSHC09.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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