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John Slabbekoorn

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2020 – today

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2022
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  - conf/vlsit/PeetersSSDGSBPW22
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Michaël Peeters, S. Sinha, Xiao Sun, Claude Desset, Giuseppe Gramegna, John Slabbekoorn, Pieter Bex, N. Pinho, Tomas Webers, Dimitrios Velenis, A. Miller, Nadine Collaert, Geert Van der Plas, Eric Beyne, M. Huynen, R. Broucke:
(Why do we need) Wireless Heterogeneous Integration (anyway?). VLSI Technology and Circuits 2022: 256-257

2010 – 2019

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2016
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Jaber Derakhshandeh, Lin Hou, Inge De Preter, Carine Gerets, Samuel Suhard, Vikas Dubey, Geraldine Jamieson, Fumihiro Inoue, Tomas Webers, Pieter Bex, Giovanni Capuz, Eric Beyne, John Slabbekoorn, Teng Wang, Anne Jourdain, Gerald Beyer, Kenneth June Rebibis, Andy Miller:
Die to wafer 3D stacking for below 10um pitch microbumps. 3DIC 2016: 1-4

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