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"Flip-chip routing with unified area-I/O pad assignments for package-board ..."

Jia-Wei Fang, Martin D. F. Wong, Yao-Wen Chang (2009)

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DOI: 10.1145/1629911.1630002

access: closed

type: Conference or Workshop Paper

metadata version: 2022-10-02

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Jia-Wei Fang, Martin D. F. Wong, Yao-Wen Chang:
Flip-chip routing with unified area-I/O pad assignments for package-board co-design. DAC 2009: 336-339

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