"An analytical compact model for estimation of stress in multiple ..."

Geert Eneman et al. (2011)

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DOI: 10.1109/DATE.2011.5763088

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-24

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  - https://dblp.org/rec/conf/date/EnemanCMMCMMBHP11
Geert Eneman, J. Cho, V. Moroz, Dragomir Milojevic, M. Choi, Kristin De Meyer, Abdelkarim Mercha, Eric Beyne, Thomas Hoffmann, Geert Van der Plas:
An analytical compact model for estimation of stress in multiple Through-Silicon Via configurations. DATE 2011: 505-506

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