"Assembly-Related Chip/Package Co-Design of Heterogeneous Systems ..."

Robert Fischbach, Tilman Horst, Jens Lienig (2019)

> Home

Details and statistics

DOI: 10.23919/DATE.2019.8714884

access: closed

type: Conference or Workshop Paper

metadata version: 2019-05-20

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/date/FischbachHL19
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/date/FischbachHL19
Robert Fischbach, Tilman Horst, Jens Lienig:
Assembly-Related Chip/Package Co-Design of Heterogeneous Systems Manufactured by Micro-Transfer Printing. DATE 2019: 956-959

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.