"Challenges and emerging solutions in testing TSV-based 2 1 over 2D- and ..."

Erik Jan Marinissen (2012)

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DOI: 10.1109/DATE.2012.6176689

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-24

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Erik Jan Marinissen:
Challenges and emerging solutions in testing TSV-based 2 1 over 2D- and 3D-stacked ICs. DATE 2012: 1277-1282

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