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Thuy Tran-Quinn

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2010 – 2019

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2019
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  - conf/irps/PremachandranTB19
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C. S. Premachandran, Thuy Tran-Quinn, Lloyd Burrell, Patrick Justison:
A Comprehensive Wafer Level Reliability Study on 65nm Silicon Interposer. IRPS 2019: 1-8
2018
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C. S. Premachandran, Seungman Choi, Salvatore Cimino, Thuy Tran-Quinn, Lloyd Burrell, Patrick Justison:
Reliability challenges for 2.5D/3D integration: An overview. IRPS 2018: 5

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