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Jeroen J. M. Zaal

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Journal Articles

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2016
[j5]
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  - journals/mr/MavinkurveMSZ16
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  - https://dblp.org/rec/journals/mr/MavinkurveMSZ16
Amar Mavinkurve, Jaume L. M. Llacer Martinez, Michiel van Soestbergen, Jeroen J. M. Zaal:
Moisture absorption by molding compounds under extreme conditions: Impact on accelerated reliability tests. Microelectron. Reliab. 64: 254-258 (2016)
2010
[j4]
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  - journals/mr/HochstenbachDYZB10
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Hendrik Pieter Hochstenbach, Willem D. van Driel, Dao-Guo Yang, Jeroen J. M. Zaal, E. Bagerman:
Designing for reliability using a new Wafer Level Package structure. Microelectron. Reliab. 50(4): 528-535 (2010)
[j3]
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  - journals/sensors/ZaalDZ10
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Jeroen J. M. Zaal, Willem D. van Driel, G. Q. Zhang:
Challenges in the Assembly and Handling of Thin Film Capped MEMS Devices. Sensors 10(4): 3989-4001 (2010)
2009
[j2]
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Jeroen J. M. Zaal, Hendrik Pieter Hochstenbach, Willem D. van Driel, G. Q. Zhang:
Solder interconnect reliability under drop impact loading conditions using High-speed Cold Bump Pull. Microelectron. Reliab. 49(8): 846-852 (2009)
2008
[j1]
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  - journals/mr/ZaalDBLBZ08
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Jeroen J. M. Zaal, W. D. van Driel, S. Bendida, Q. Li, J. T. M. van Beek, G. Q. Zhang:
Packaging influences on the reliability of MEMS resonators. Microelectron. Reliab. 48(8-9): 1567-1571 (2008)

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