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ORCIDDao-Guo Yang
Person information
- affiliation: Guilin University of Electronic Technology, Guilin, China
- affiliation: Delft University of Technology, Delft, The Netherlands
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2020 – today
- 2024
[j26]Hengjian He
, Miao Cai, Minghui Yun, Hao Chen, Huanhuan Wang, Dao-Guo Yang:
Highly Stable Pin Pull Test Method for PCB Pad Cratering Characterization. IEEE Trans. Instrum. Meas. 73: 1-8 (2024)- 2021
- [j25]Dao-Guo Yang, Daoshuang Geng, Lixia Zheng, Miao Cai, Weidong Hao:
Entropy-based analysis and classification of acute tonic pain from microwave transcranial signals obtained via the microwave-scattering approach. Biomed. Signal Process. Control. 65: 102391 (2021) - 2020
- [j24]Daoshuang Geng, Dao-Guo Yang, Miao Cai, Weidong Hao:
Evaluation of Acute Tonic Cold Pain From Microwave Transcranial Transmission Signals Using Multi-Entropy Machine Learning Approach. IEEE Access 8: 2780-2791 (2020) - [j23]Miao Cai, Peng Cui, Yikang Qin, Daoshuang Geng, Qiqin Wei, Xiyou Wang, Dao-Guo Yang, Guoqi Zhang:
Entropy Generation Methodology for Defect Analysis of Electronic and Mechanical Components - A Review. Entropy 22(2): 254 (2020) - [j22]Daoshuang Geng, Dao-Guo Yang, Miao Cai, Lixia Zheng:
A Novel Microwave Treatment for Sleep Disorders and Classification of Sleep Stages Using Multi-Scale Entropy. Entropy 22(3): 347 (2020)
2010 – 2019
- 2019
- [j21]Miao Cai, Yonghu Liang, Minghui Yun, Xuan-You Chen, Haidong Yan, Zhaozhe Yu, Dao-Guo Yang, Guoqi Zhang:
Effects of Thermal Reflowing Stress on Mechanical Properties of Novel SMT-SREKs. IEEE Access 7: 27106-27114 (2019) - [j20]Miao Cai, Zhi Liang, Kunmiao Tian, Minghui Yun, Ping Zhang, Dao-Guo Yang, Guoqi Zhang:
Junction Temperature Prediction for LED Luminaires Based on a Subsystem-Separated Thermal Modeling Method. IEEE Access 7: 119755-119764 (2019) - [j19]Daoshuang Geng, Dao-Guo Yang, Miao Cai, Weidong Hao, Xiaoming Li:
Detection of Acute Tonic Cold Pain From Microwave Transcranial Transmission Signals Obtained via the Microwave Scattering Approach. IEEE Access 7: 142388-142405 (2019) - 2018
- [j18]Ning Yang, Dao-Guo Yang, Guoqi Zhang, Liangbiao Chen, Dongjing Liu, Miao Cai, Xuejun Fan:
The Effects of Graphene Stacking on the Performance of Methane Sensor: A First-Principles Study on the Adsorption, Band Gap and Doping of Graphene. Sensors 18(2): 422 (2018) - 2016
- [j17]Miao Cai, Dao-Guo Yang, Jianna Zheng, Jianlin Huang, Dongjing Liu, Jing Xiao, Ping Zhang, Guoqi Zhang, Xianping Chen:
Effects of stress-loading test methods on the degradation of light-emitting diode modules. Microelectron. Reliab. 64: 635-639 (2016) - [j16]Jianlin Huang, Dusan S. Golubovic, Sau Koh, Dao-Guo Yang, Xiupeng Li, Xuejun Fan, G. Q. Zhang:
Lumen degradation modeling of white-light LEDs in step stress accelerated degradation test. Reliab. Eng. Syst. Saf. 154: 152-159 (2016) - 2015
- [j15]Miao Cai, Dao-Guo Yang, Kunmiao Tian, Ping Zhang, Xianping Chen, Lilin Liu, Guoqi Zhang:
Step-stress accelerated testing of high-power LED lamps based on subsystem isolation method. Microelectron. Reliab. 55(9-10): 1784-1789 (2015) - [j14]Zaifu Cui, Miao Cai, Ruifeng Li, Ping Zhang, Xianping Chen, Dao-Guo Yang:
A numerical procedure for simulating thermal oxidation diffusion of epoxy molding compounds. Microelectron. Reliab. 55(9-10): 1877-1881 (2015) - [j13]Jianlin Huang, Dusan S. Golubovic, Sau Koh, Dao-Guo Yang, Xiupeng Li, Xuejun Fan, G. Q. Zhang:
Optical degradation mechanisms of mid-power white-light LEDs in LM-80-08 tests. Microelectron. Reliab. 55(12): 2654-2662 (2015) - [j12]Weijie Liang, Ping Zhang, Xianping Chen, Miao Cai, Dao-Guo Yang:
Genetic Algorithm (GA)-Based Inclinometer Layout Optimization. Sensors 15(4): 9136-9155 (2015) - 2013
- [j11]Miao Cai, D. J. Xie, W. B. Chen, B. Y. Wu, Dao-Guo Yang, G. Q. Zhang:
A novel soldering method to evaluate PCB pad cratering for pin-pull testing. Microelectron. Reliab. 53(9-11): 1568-1574 (2013) - 2011
- [j10]Dao-Guo Yang, F. F. Wan, Z. Y. Shou, Willem D. van Driel, H. Scholten, L. Goumans, Roberto Faria:
Effect of high temperature aging on reliability of automotive electronics. Microelectron. Reliab. 51(9-11): 1938-1942 (2011) - 2010
- [j9]Hendrik Pieter Hochstenbach, Willem D. van Driel, Dao-Guo Yang, Jeroen J. M. Zaal, E. Bagerman:
Designing for reliability using a new Wafer Level Package structure. Microelectron. Reliab. 50(4): 528-535 (2010) - [j8]Dao-Guo Yang, Martien Kengen, W. G. M. Peels, David Heyes, W. D. van Driel:
Reliability modeling on a MOSFET power package based on embedded die technology. Microelectron. Reliab. 50(7): 923-927 (2010)
2000 – 2009
- 2008
- [j7]W. D. van Driel, Dao-Guo Yang, G. Q. Zhang:
On chip-package stress interaction. Microelectron. Reliab. 48(8-9): 1268-1272 (2008) - [c1]Miao Cai, Dao-Guo Yang, Wenbin Chen, Quan-Yong Li:
An Optimum Design Method for Nonlinear System Using an Improved Neural Network. CSSE (1) 2008: 94-97 - 2007
- [j6]Dao-Guo Yang, Kaspar M. B. Jansen, Leo J. Ernst, G. Q. Zhang, H. J. L. Bressers, J. H. J. Janssen:
Effect of filler concentration of rubbery shear and bulk modulus of molding compounds. Microelectron. Reliab. 47(2-3): 233-239 (2007) - [j5]C. van't Hof, Kaspar M. B. Jansen, G. Wisse, Leo J. Ernst, Dao-Guo Yang, G. Q. Zhang, H. J. L. Bressers:
Novel shear tools for viscoelastic characterization of packaging polymers. Microelectron. Reliab. 47(2-3): 240-247 (2007) - [j4]Dao-Guo Yang, Kaspar M. B. Jansen, Leo J. Ernst, G. Q. Zhang, W. D. van Driel, H. J. L. Bressers, J. H. J. Janssen:
Numerical modeling of warpage induced in QFN array molding process. Microelectron. Reliab. 47(2-3): 310-318 (2007) - [j3]Willem D. van Driel, Dao-Guo Yang, Cadmus A. Yuan, M. van Kleef, G. Q. (Kouchi) Zhang:
Mechanical reliability challenges for MEMS packages: Capping. Microelectron. Reliab. 47(9-11): 1823-1826 (2007) - 2006
- [j2]W. D. van Driel, Olaf van der Sluis, Dao-Guo Yang, R. L. J. M. Ubachs, C. Zenz, G. Aflenzer, G. Q. Zhang:
Reliability modelling for packages in flexible end-products. Microelectron. Reliab. 46(9-11): 1880-1885 (2006) - 2004
- [j1]Dao-Guo Yang, J. S. Liang, Quan-Yong Li, Leo J. Ernst, G. Q. Zhang:
Parametric study on flip chip package with lead-free solder joints by using the probabilistic designing approach. Microelectron. Reliab. 44(12): 1947-1955 (2004)
Coauthor Index
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