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Hendrik Pieter Hochstenbach

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Journal Articles

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2010
[j3]
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  - journals/mr/HochstenbachDYZB10
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  - https://dblp.org/rec/journals/mr/HochstenbachDYZB10
Hendrik Pieter Hochstenbach, Willem D. van Driel, Dao-Guo Yang, Jeroen J. M. Zaal, E. Bagerman:
Designing for reliability using a new Wafer Level Package structure. Microelectron. Reliab. 50(4): 528-535 (2010)
2009
[j2]
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Jeroen J. M. Zaal, Hendrik Pieter Hochstenbach, Willem D. van Driel, G. Q. Zhang:
Solder interconnect reliability under drop impact loading conditions using High-speed Cold Bump Pull. Microelectron. Reliab. 49(8): 846-852 (2009)
2008
[j1]
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Fenglian Sun, Hendrik Pieter Hochstenbach, Willem D. van Driel, G. Q. (Kouchi) Zhang:
Fracture morphology and mechanism of IMC in Low-Ag SAC Solder/UBM (Ni(P)-Au) for WLCSP. Microelectron. Reliab. 48(8-9): 1167-1170 (2008)

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