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Kan Wang 0003
Person information
- affiliation: Tsinghua University, Beijing, China
Other persons with the same name
- Kan Wang — disambiguation page
- Kan Wang 0001 (aka: Kan (Kevin) Wang) — Georgia Institute of Technology, Manufacturing Institute, Atlanta, GA, USA (and 1 more)
- Kan Wang 0002
— Beihang University, Beijing, China - Kan Wang 0004
— Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, China - Kan Wang 0005
— National Time Service Center, Chinese Academy of Sciences, Xi'an, China - Kan Wang 0006
— Shanghai Jiao Tong University, Shanghai, China - Kan Wang 0007
— State Key Laboratory of Cryptology, Beijing, China - Kan Wang 0008
— Auckland University of Technology, Auckland, New Zealand - Kan Wang 0009
— Southeast University, Nanjing, China - Kan Wang 0010
— Xi'an University of Technology, Xi'an, China
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2010 – 2019
- 2014
[j2]Kan Wang
, Sheqin Dong, Huaxi Wang, Qian Chen, Tao Lin:
Mixed-Crossing-Avoided Escape Routing of Mixed-Pattern Signals on Staggered-Pin-Array PCBs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 33(4): 571-584 (2014)
[c7]Kan Wang
, Sheqin Dong:
Post-floorplanning power optimization for MSV-driven application specific NoC design. ISCAS 2014: 994-997- 2013
[c6]Kan Wang
, Sheqin Dong:
Power optimization for application-specific 3D network-on-chip with multiple supply voltages. ASP-DAC 2013: 362-367
[c5]Kan Wang
, Huaxi Wang, Sheqin Dong:
Escape routing of mixed-pattern signals based on staggered-pin-array PCBs. ISPD 2013: 93-100- 2012
[c4]Kan Wang
, Jihong Shen:
Multi-Objective Light Ray Optimization. CSO 2012: 822-825
[c3]Kan Wang
, Sheqin Dong, Satoshi Goto:
Voltage island-driven power optimization for application specific network-on-chip design. ACM Great Lakes Symposium on VLSI 2012: 171-176
[c2]Kan Wang
, Sheqin Dong, Yuchun Ma, Satoshi Goto, Jason Cong:
Leakage-aware performance-driven TSV-planning based on network flow algorithm in 3D ICs. ISQED 2012: 129-136- 2011
[j1]Kan Wang
, Sheqin Dong, Yuchun Ma, Yu Wang
, Xianlong Hong, Jason Cong:
Leakage-Aware TSV-Planning with Power-Temperature-Delay Dependence in 3D ICs. IEICE Trans. Fundam. Electron. Commun. Comput. Sci. 94-A(12): 2490-2498 (2011)
[c1]Kan Wang
, Yuchun Ma, Sheqin Dong, Yu Wang, Xianlong Hong, Jason Cong:
Rethinking thermal via planning with timing-power-temperature dependence for 3D ICs. ASP-DAC 2011: 261-266
Coauthor Index

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