"Rethinking thermal via planning with timing-power-temperature dependence ..."

Kan Wang et al. (2011)

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DOI: 10.1109/ASPDAC.2011.5722195

access: closed

type: Conference or Workshop Paper

metadata version: 2017-06-15

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Kan Wang, Yuchun Ma, Sheqin Dong, Yu Wang, Xianlong Hong, Jason Cong:
Rethinking thermal via planning with timing-power-temperature dependence for 3D ICs. ASP-DAC 2011: 261-266

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