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Journal Articles
- 2016
[j4]Andres Garcia, Nathan Warner, Nandika Anne D'Souza
, Enis Tuncer, Luu Nguyen, Marie Denison, Jeffrey T. Fong:
Reliability of High-Voltage Molding Compounds: Particle Size, Curing Time, Sample Thickness, and Voltage Impact on Polarization. IEEE Trans. Ind. Electron. 63(11): 7104-7111 (2016)- 2005
- [j3]Michael Heer, Viktor Dubec, M. Blaho, Sergey Bychikhin, Dionyz Pogany, Erich Gornik, Marie Denison, Matthias Stecher, Gerhard Groos:
Automated setup for thermal imaging and electrical degradation study of power DMOS devices. Microelectron. Reliab. 45(9-11): 1688-1693 (2005) - 2004
- [j2]Viktor Dubec, Sergey Bychikhin, M. Blaho, Michael Heer, Dionyz Pogany, Marie Denison, Nils Jensen, Matthias Stecher, Gerhard Groos, Erich Gornik:
Multiple-time-instant 2D thermal mapping during a single ESD event. Microelectron. Reliab. 44(9-11): 1793-1798 (2004) - 2003
- [j1]M. Blaho, Dionyz Pogany, Erich Gornik, Marie Denison, Gerhard Groos, Matthias Stecher:
Study of internal behavior in a vertical DMOS transistor under short high current stress by an interferometric mapping method. Microelectron. Reliab. 43(4): 545-548 (2003)
Conference and Workshop Papers
- 2014
- [c2]Ilaria Imperiale, Susanna Reggiani, Elena Gnani, Antonio Gnudi, Giorgio Baccarani, Luu Nguyen, Marie Denison:
TCAD modeling of encapsulation layer in high-voltage, high-temperature operation regime. ESSDERC 2014: 325-328 - 2013
- [c1]Susanna Reggiani, Elena Gnani, Antonio Gnudi, Giorgio Baccarani, Stefano Poli, Rick Wise, Ming-Yeh Chuang, Weidong Tian, Marie Denison:
Modeling and characterization of hot-carrier stress degradation in power MOSFETs (invited). ESSDERC 2013: 91-94
Coauthor Index
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