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"Numerical and experimental study on Cu protrusion of Cu-filled ..."
Fa Xing Che et al. (2011)
- Fa Xing Che
, Wahyuaji Narottama Putra
, A. Heryanto, A. Trigg, S. Gao, Chee Lip Gan:
Numerical and experimental study on Cu protrusion of Cu-filled through-silicon vias (TSV). 3DIC 2011: 1-6
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