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"Low-Temperature Wafer-Level Metal Bonding with Gold Thin Film at 100 °C."
Po-Chih Chen, Demin Liu, Kuan-Neng Chen (2019)
- Po-Chih Chen, Demin Liu, Kuan-Neng Chen:
Low-Temperature Wafer-Level Metal Bonding with Gold Thin Film at 100 °C. 3DIC 2019: 1-4
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