"Integration of Damage-less Probe Cards Using Nano-TSV Technology for ..."

Takafumi Fukushima et al. (2021)

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DOI: 10.1109/3DIC52383.2021.9687601

access: closed

type: Conference or Workshop Paper

metadata version: 2024-08-04

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Takafumi Fukushima, Shinichi Sakuyama, Masatomo Takahashi, Hiroyuki Hashimoto, Jichoel Bea, Theodorus Marcello, Hisashi Kino, Tetsu Tanaka, Mitsumasa Koyanagi, Mariappan Murugesan:
Integration of Damage-less Probe Cards Using Nano-TSV Technology for Microbumped Wafer Testing. 3DIC 2021: 1-4

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