"High speed I/O and thermal effect characterization of 3D stacked ICs."

Moishe Groger et al. (2009)

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DOI: 10.1109/3DIC.2009.5306528

access: closed

type: Conference or Workshop Paper

metadata version: 2024-10-06

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Moishe Groger, Shadi M. Harb, Devin Morris, William R. Eisenstadt, Sudeep Puligundla:
High speed I/O and thermal effect characterization of 3D stacked ICs. 3DIC 2009: 1-5

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