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"High performance 3D interconnects based on electrochemical etch and liquid ..."

Harry Hedler et al. (2010)

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DOI: 10.1109/3DIC.2010.5751449

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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  - https://dblp.org/rec/conf/3dic/HedlerSSKR10
Harry Hedler, Thomas Scheiter, Markus Schieber, Armin Klumpp, Peter Ramm:
High performance 3D interconnects based on electrochemical etch and liquid metal fill. 3DIC 2010: 1-7

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