"3D stacking using Cu-Cu direct bonding."

Y. H. Hu et al. (2011)

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DOI: 10.1109/3DIC.2012.6262944

access: closed

type: Conference or Workshop Paper

metadata version: 2021-10-14

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  - conf/3dic/HuLLRJMBBY11
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  - https://dblp.org/rec/conf/3dic/HuLLRJMBBY11
Y. H. Hu, C. S. Liu, M. J. Lii, Kenneth J. Rebibis, Anne Jourdain, Antonio La Manna, Gerald Beyer, Eric Beyne, C. H. Yu:
3D stacking using Cu-Cu direct bonding. 3DIC 2011: 1-4

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