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"High temperature bonding solutions enabling thin wafer process and ..."
Toshiaki Itabashi et al. (2011)
- Toshiaki Itabashi, Masashi Kotani, Melvin P. Zussman, K. Zoschke, T. Fischer, M. Topper, Hiroyuki Ishida:
High temperature bonding solutions enabling thin wafer process and handling on 3D-IC manufacturing. 3DIC 2011: 1-4
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