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"Material improvement for ultrathin-wafer handling in TSV creation and ..."

Amadine Jouve et al. (2009)

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DOI: 10.1109/3DIC.2009.5306523

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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  - conf/3dic/JouveHBDPBDH09
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  - https://dblp.org/rec/conf/3dic/JouveHBDPBDH09
Amadine Jouve, Wenbin Hong, D. Blumenshine, JoElle Dachsteiner, Rama Puligadda, Dongshun Bai, J. Diaz, David Henry:
Material improvement for ultrathin-wafer handling in TSV creation and PECVD process. 3DIC 2009: 1-5

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