"3D integration and challenges for advanced RF and microwave systems: EDA ..."

Rosa R. Lahiji, Timothy T. Lee, Warren P. Snapp (2016)

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DOI: 10.1109/3DIC.2016.7970042

access: closed

type: Conference or Workshop Paper

metadata version: 2017-07-13

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Rosa R. Lahiji, Timothy T. Lee, Warren P. Snapp:
3D integration and challenges for advanced RF and microwave systems: EDA perspective. 3DIC 2016: 1-2

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