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"Thermal analysis for a SiGe HBT 40 watt 32 GHz clock 3D memory processor ..."

John F. McDonald et al. (2009)

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DOI: 10.1109/3DIC.2009.5306570

access: closed

type: Conference or Workshop Paper

metadata version: 2024-02-29

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  - conf/3dic/McDonaldEJBGZCKCDLK09
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  - https://dblp.org/rec/conf/3dic/McDonaldEJBGZCKCDLK09
John F. McDonald, Okan Erdogan, Philip Jacob, Paul M. Belemjian, Alexey Gutin, Aamir Zia, Michael Chu, Jin Woo Kim, Ryan Clarke, Nate DeSimone, Sherry Liu, Russell P. Kraft:
Thermal analysis for a SiGe HBT 40 watt 32 GHz clock 3D memory processor chip stack using diamond heat spreader layers. 3DIC 2009: 1-7

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