"Thermal Analysis of Reflow Process for PIC-Embedded Package Substrate with ..."

Akihiro Noriki et al. (2024)

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DOI: 10.1109/3DIC63395.2024.10830043

access: closed

type: Conference or Workshop Paper

metadata version: 2025-01-23

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Akihiro Noriki, Hirotaka Uemura, Haruhiko Kuwatsuka, Naoki Matsui, Reona Motoji, Dan Maeda, Tomoya Sugita, Fumi Nakamura, Takeru Amano:
Thermal Analysis of Reflow Process for PIC-Embedded Package Substrate with 2.3D RDL Interposer for Co-Packaged Optics. 3DIC 2024: 1-3

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