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"3D Stacked IC demonstrator using Hybrid Collective Die-to-Wafer bonding ..."

Jan Van Olmen et al. (2009)

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DOI: 10.1109/3DIC.2009.5306600

access: closed

type: Conference or Workshop Paper

metadata version: 2021-10-14

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  dblp key:
  - conf/3dic/OlmenCDMHJKMRSTBS09
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  persistent URL:
  - https://dblp.org/rec/conf/3dic/OlmenCDMHJKMRSTBS09
Jan Van Olmen, Jan Coenen, Wim Dehaene, Kristin De Meyer, Cedric Huyghebaert, Anne Jourdain, Guruprasad Katti, Abdelkarim Mercha, Michal Rakowski, Michele Stucchi, Youssef Travaly, Eric Beyne, Bart Swinnen:
3D Stacked IC demonstrator using Hybrid Collective Die-to-Wafer bonding with copper Through Silicon Vias (TSV). 3DIC 2009: 1-5

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