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"Heat spreading packaging solutions for hybrid bonded 3D-ICs."
Rafael Prieto et al. (2016)
- Rafael Prieto, Perceval Coudrain
, Jean-Philippe Colonna, Y. Hallez, Christian Chancel, V. Rat, Sylvain Dumas, G. Romano, R. Franiatte, C. Brunet-Manquiat, Séverine Cheramy, Alexis Farcy:
Heat spreading packaging solutions for hybrid bonded 3D-ICs. 3DIC 2016: 1-6
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