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"Low-temperature bonding of LSI chips to PEN film using Au cone bump for ..."

Takanori Shuto et al. (2011)

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DOI: 10.1109/3DIC.2012.6263012

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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Takanori Shuto, Naoya Watanabe, Akihiro Ikeda, Tanemasa Asano:
Low-temperature bonding of LSI chips to PEN film using Au cone bump for heterogeneous integration. 3DIC 2011: 1-4

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