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"Impact of thermal through silicon via (TTSV) on the temperature profile of ..."

Shiv Govind Singh, Chuan Seng Tan (2009)

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DOI: 10.1109/3DIC.2009.5306527

access: closed

type: Conference or Workshop Paper

metadata version: 2021-10-14

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Shiv Govind Singh, Chuan Seng Tan:
Impact of thermal through silicon via (TTSV) on the temperature profile of multi-layer 3-D device stack. 3DIC 2009: 1-4

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