"Vertical Optical and Electrical Interconnection for Chip-Scale-Packaged Si ..."

Koichi Takemura et al. (2019)

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DOI: 10.1109/3DIC48104.2019.9058778

access: closed

type: Conference or Workshop Paper

metadata version: 2020-04-19

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Koichi Takemura, Akio Ukita, Yasuhiro Ibusuki, Mitsuru Kurihara, Akihiro Noriki, Takeru Amano, Daisuke Okamoto, Yasuyuki Suzuki, Kazuhiko Kurata:
Vertical Optical and Electrical Interconnection for Chip-Scale-Packaged Si Photonic Transceivers. 3DIC 2019: 1-6

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