"Keynote speakers day 1: 3D integration with TSV interconnects: Technology ..."

Christophe Zinck (2010)

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DOI: 10.1109/3DIC.2010.5751427

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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Christophe Zinck:
Keynote speakers day 1: 3D integration with TSV interconnects: Technology trends & market analysis. 3DIC 2010: 1-2

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