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"Circuit Assemblies: Electronic Modules for Interactive 3D-Prints."

Tiffany Tseng, Yoshihiro Kawahara (2021)

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DOI: 10.1145/3461778.3462024

access: closed

type: Conference or Workshop Paper

metadata version: 2021-07-05

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  dblp key:
  - conf/ACMdis/TsengK21
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Tiffany Tseng, Yoshihiro Kawahara:
Circuit Assemblies: Electronic Modules for Interactive 3D-Prints. Conference on Designing Interactive Systems 2021: 1115-1128

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