"ILP-based inter-die routing for 3D ICs."

Chia-Jen Chang et al. (2011)

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DOI: 10.1109/ASPDAC.2011.5722209

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-26

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Chia-Jen Chang, Pao-Jen Huang, Tai-Chen Chen, Chien-Nan Jimmy Liu:
ILP-based inter-die routing for 3D ICs. ASP-DAC 2011: 330-335

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