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"Low-temperature void-free wafer-level adhesive bonding for thin film ..."

Fang Zhong et al. (2012)

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DOI: 10.1109/BMEI.2012.6513169

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-17

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Fang Zhong, Tao Dong, He Yong, Su Yan:
Low-temperature void-free wafer-level adhesive bonding for thin film transfer by nano-imprint resist. BMEI 2012: 757-760

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