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"Intercircuit: Electroplating with Cavities for Fast Fabrication of Complex ..."

Xiaolong Li et al. (2024)

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DOI: 10.1145/3613905.3651098

access: closed

type: Conference or Workshop Paper

metadata version: 2024-05-17

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  - https://dblp.org/rec/conf/chi/LiYZFLCHDXW24
Xiaolong Li, Cheng Yao, Yujie Zhou, Shuyue Feng, Zhengke Li, Yiming Cheng, Shichao Huang, Haoye Dong, Mengru Xue, Guanyun Wang:
Intercircuit: Electroplating with Cavities for Fast Fabrication of Complex and High-Performance 3D Circuits. CHI Extended Abstracts 2024: 201:1-201:6

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