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"Three-dimensional integration technology using through-si via based on ..."
Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka (2010)
- Mitsumasa Koyanagi, Takafumi Fukushima, Tetsu Tanaka:
Three-dimensional integration technology using through-si via based on reconfigured wafer-to-wafer bonding. CICC 2010: 1-4
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