"Tier-partitioning for power delivery vs cooling tradeoff in 3D VLSI for ..."

Shreepad Panth et al. (2015)

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DOI: 10.1145/2744769.2744917

access: closed

type: Conference or Workshop Paper

metadata version: 2022-10-02

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Shreepad Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim:
Tier-partitioning for power delivery vs cooling tradeoff in 3D VLSI for mobile applications. DAC 2015: 92:1-92:6

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