"Tier-partitioning for power delivery vs cooling tradeoff in 3D VLSI for ..."

Shreepad Panth et al. (2015)

Details and statistics

DOI: 10.1145/2744769.2744917

access: closed

type: Conference or Workshop Paper

metadata version: 2022-10-02

a service of  Schloss Dagstuhl - Leibniz Center for Informatics