"Full-chip multiple TSV-to-TSV coupling extraction and optimization in 3D ICs."

Taigon Song et al. (2013)

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DOI: 10.1145/2463209.2488956

access: closed

type: Conference or Workshop Paper

metadata version: 2022-10-02

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Taigon Song, Chang Liu, Yarui Peng, Sung Kyu Lim:
Full-chip multiple TSV-to-TSV coupling extraction and optimization in 3D ICs. DAC 2013: 180:1-180:7

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