"Efficient transient thermal simulation of 3D ICs with liquid-cooling and ..."

Alain Fourmigue, Giovanni Beltrame, Gabriela Nicolescu (2014)

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DOI: 10.7873/DATE.2014.087

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-23

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Alain Fourmigue, Giovanni Beltrame, Gabriela Nicolescu:
Efficient transient thermal simulation of 3D ICs with liquid-cooling and through silicon vias. DATE 2014: 1-6

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