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"A quantitative analysis of performance benefits of 3D die stacking on ..."
Dongki Kim et al. (2011)
- Dongki Kim, Sungjoo Yoo, Sunggu Lee, Jung Ho Ahn, Hyunuk Jung:
A quantitative analysis of performance benefits of 3D die stacking on mobile and embedded SoC. DATE 2011: 1333-1338
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