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"PDMS Gasket Underfill for Long-Term Insulation of High-Density ..."

Sharif Khan et al. (2018)

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DOI: 10.1109/EMBC.2018.8512884

access: closed

type: Conference or Workshop Paper

metadata version: 2023-05-22

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  dblp key:
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Sharif Khan, Daniel Scholz, Juan S. Ordonez, Thomas Stieglitz:
PDMS Gasket Underfill for Long-Term Insulation of High-Density Interconnections in Active Implantable Medical Devices. EMBC 2018: 2941-2944

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